XC3042A-7PG132I

Product Summary

The XC3042A-7PG132I is a Field Programmable Gate Array. The XC3042A-7PG132I provides a group of high-performance, high-density, digital integrated circuits. Its regular, extendable, flexible, user-programmable array architecture is composed of a configuration program store plus three types of configurable elements: a perimeter of I/O Blocks (IOBs), a core array of Configurable Logic Bocks (CLBs) and resources for interconnection. The development system provides schematic capture and auto place-and-route for design entry. Logic and timing simulation and in-circuit emulation are available as design verification alternatives. The design editor is used for interactive design optimization, and to compile the data pattern that represents the configuration program.

Parametrics

XC3042A-7PG132I absolute maximum ratings: (1)VCC Supply voltage relative to GND: –0.5V to +7.0V; (2)VIN Input voltage with respect to GND: –0.5 to VCC +0.5V; (3)VTS Voltage applied to 3-state output: –0.5 to VCC +0.5V; (4)TSTG Storage temperature (ambient): –65℃ to +150℃; (5)TSOL Maximum soldering temperature (10 s @ 1/16 in.): +260℃; (6) Junction temperature plastic: +125℃; (7) Junction temperature ceramic: +150℃.

Features

XC3042A-7PG132I features: (1)Complete line of four related Field Programmable Gate Array product families; (2)Replaces TTL, MSI, and other PLD logic; (3)Integrates complete sub-systems into a single package; (4)Avoids the NRE, time delay, and risk of conventional masked gate arrays; (5)Guaranteed toggle rates of 70 to 370 MHz, logic delays from 7 to 1.5ns; (6)System clock speeds over 85 MHz; (7)Low quiescent and active power consumption; (8)Compatible arrays ranging from 1,000 to 7,500 gate complexity; (9)Extensive register, combinatorial, and I/O capabilities; (10)High fan-out signal distribution, low-skew clock nets; (11)Internal 3-state bus capabilities; (12)TTL or CMOS input thresholds; (13)On-chip crystal oscillator amplifier; (14)Easy design iteration; (15)In-system logic changes; (16)Over 20 different packages; (17)Thin and Very Thin Quad Flat Pack (TQFP and VQFP) options; (18)Plastic and ceramic surface-mount and pin-gridarray packages; (19)Standard, off-the-shelf product availability; (20)100% factory pre-tested devices; (21)Excellent reliability record.

Diagrams